Semiconductor Packaging
Read and see more about how Xradia's MicroXCT can improve insight into Semiconductor Packaging.
Die-level Copper / Aluminum Interconnect Failure Analysis and Metrology
Xradia’s nanoXFi x-ray fluorescence imager offers an attractive non-destructive alternative analysis method by selectively imaging the interconnect metal at high spatial resolution, even for buried defects up to 2um deep.
High-resolution Elemental Analysis Of Phase Separation In Composite Materials
Xradia's nanoXFi enables high-resolution (sub-80nm) elemental imaging of a selected element at a time of an extend area on the sample.
Tubular Fuel Cell Imaging
Xradia's high resolution nanoXCT on a small fragment of the fuel cell.
3D X-ray Tomography of STM Tungsten Tip
nanoXCT used on a Scanning Transmission Microscope (STM) solid 1.2 um Tungsten Tip.
3D X-ray Tomography and Delayering of a Pentium 4 Microporcessor
A Pentium 4 imaged on Xradia's nanoXCT demonstrating the capabilities of this sub 50 nm high resolution tool.
Electromigration Studies of a Cu Via
Xradia's nanoXCT detects electromigration in a semiconductor sample.
Energy-tunable transmission x-ray microscope for differential contrast imaging with near 60 nm resolution tomography.
Journal article from American Physics Letters.
