Semiconductor, Packaging
(Advanced Packaging, Failure analysis, MEMs )
Abstract 1
S H Lau1, David Vallet2, Andrei Tkachuk1, Michael Feser1 , Hongtao Cui1 , Fred Duewer1, Wenbing Yun1
“Non Destructive Failure Analysis Technique With a Laboratory Based 3D X-ray Nanotomography System”,
Proceedings of LSI Testing Symposium, Japan ( 2006)
1 Xradia, Inc, Concord, CA, USA
2 IBM Systems & Technology Group, Essex Junction, VT, USA
Keywords
X-ray computed tomography, nanotomography, Frenel zone plates, Zernike phase contrast, die level failure analysis, voids, shorts, Cu interconnects, competitive analysis
Abstract 2
S H Lau , Cheok I (Joanna) Cheong, Hauyee Chang, Frederick Duewer, Michael Feser, Wenbing Yun
“Non destructive characterization of advanced package and die level defects - with novel 3D x-ray micro and nanotomography systems”, Semiconductor Manufacturing (Chinese edition), Feb 2007, Vol 8, issue 2, pp 21-25
Keywords
X-ray computed tomography, advanced packages, failure analysis, solder cracks, solder non wets, die cracks, via cracks, delaminination, metal migration, C4 bumps, flip chip, MEMs.
Abstract 3
David Scott, Fred Duewer, Shashi Kamath, Alan Lyon, David Trapp, Wenbing Yun
“High Resolution 3D Tomography for advanced packaging,
ISTFA Proceedings 2003
Keywords
X-ray computed tomography, artifact free tomography, geometric unsharpness, limited angle problem, flip chip, advanced package
