Go to next page The Xradia MicroXCT is the proven leader for 3D imaging of internal structure within Semiconductor Packages. Xradia’s extensive 3D tomographic x-ray imaging experience in this area includes, but is not limited to:
- Stacked Die – Certain Cracks, voids in adhesives, broken leads
- BGA/Flip Chip Packages – Voids/cracks/shear in solder balls, delamination, incomplete fill, wetting issues
- Internal Stress Damage – Level 1 (within die) and Level 2 (chip to board) reliability issues
- Pb Free – Snowmen, wetting issues, whiskers
- General Packaging – Broken or shorted leads, pump out of TIM (thermal interface material), warped die inside thermal sealed packages, Automotive packages and sensors, Fiber Optics, bond wire defects]
This is the same 3D image in the previous slide sliced in another direction. After viewing the 3D reconstruction from various directions, defects such as wetting issues and delamination can be easily detected. The MicroXCT allows you to “get in behind” features to find “hidden” defects.
This is an example of a 3D image of a BGA. The clear advantage of the MicroXCT for Semiconductor packaging is the ability to create a 3D tomographic reconstruction of the sample without ANY disassembly of the device. Viewing the 3D reconstruction allows the user to “view inside” the device to determine various failure modes or artifacts contained in the structure or material. This leads to faster sample turn times, giving quick results in your FA Lab or in R&D. As seen in the 3D movie, a device can be sliced and viewed from any angle as desired. The sample is still intact and can be subjected to further electrical test after 3D viewing.