This is an image of a cracked solder ball. After a customer determined that the device was problematic in electrical test, Xradia quickly determined the solder ball had cracked creating the open circuit.
Solder balls are typically 500-600 Microns in diameter

This image is an example of voiding in solder balls within a Semiconductor package. This imaging is achieved without any destructive decapsulation or disassembly of the device.

After determining the location of a failure by electrical test, finding the problematic nature of the failure is quick and easy with the MicroXCT. The MicroXCT can also be utilized to randomly scan for defects

This is an image of a defective Au bond wire. The unique advantage of Xradia’s MicroXCT is the ability to quickly generate a 3D tomographic image. This 3D device image was imaged and then rotated to reveal a internal broken wire that was not be seen in conventional 2D x-ray.

This image is an example of delamination inside a Semiconductor Package that was located and imaged after performing a 3D tomographic reconstruction on a customers sample.

This image is an example of a crack in a stacked die. Although challenging, the MicroXCT has the unique ability to find certain cracks in stacked die and voids in adhesive within stacked die. Traditional 2D x-ray without full 3D tomographic reconstruction cannot see these very difficult low contrast failure modes.

This is an example of a broken lead within a Semiconductor package. The nature of the failure was easily determined with a quick 3D tomographic reconstruction of the device. The whole device was imaged internally on the Xradia MicroXCT without any preparation or decapsulation.