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Advanced product development and innovative research greatly depends on effective imaging solutions to expose internal structures and allow researchers and engineers to develop and confirm models to describe the properties and behavior of materials of interest. Key to effective imaging is the ability to use a succession of increasing resolutions combined with smaller and smaller fields of view to allow you to 'zoom' into the particular area of interest. Ideally you can start with scanning mode, using a large field of view up to centimeters in size and resolution of tens of microns. You then move on to resolutions in the sub micron scale with a field of view of a few millimeters, and further down to nanoscale resolution with a field of view of microns. In addition, as product and sample complexity increases, it becomes more and more challenging to fully understand the three dimensional intricacies of structures, so that 3D imaging modalities are required. Alternative two dimensional imaging modalities such as TEM and FIB/SEM require complex procedures and skills to reconstruct the 3D models and confirm three dimensional dependencies between the various internal structures of the sample.

Xradia offers X-ray microscopes (XRM), advanced imaging solutions using X-ray computed tomography (CT) scanning technology combined with proprietary X-ray optics. Xradia's multi-lengthscale solution combines the VersaXRM family and UltraXRM lab platforms to provide the only 3D non-destructive imaging solution from millimeter to nanometer length scale. The VersaXRM utilizes patented X-ray detectors and an optical microscope style turret with magnifying objective detectors for easy zooming. You can go from a scanning mode and about 30 micron resolution all the way down to sub-micron pixel resolution with about 2 mm field of view. The UltraXRM nanoscale X-ray microscope is the only commercially available X-ray microscope that utilizes synchrotron based X-ray optics and provides true sub-100 nm 3D volumetric resolution.

The MicroXCT platform includes the following systems –

  • VersaXRM-500 – offering the industry's largest working distance at highest resolution for utmost flexibility for small and large samples, with 3D submicron true spatial resolution, a weight capability up to 15 kg, and samples sizes to 300 mm. The VersaXRM-500 supports a wide variety of in situ rigs for submicron resolution of practical sized samples for real-world imaging in real-world environments.
  • MicroXCT-200 – a flexible and easy to use system for general purpose imaging at sub-1 micron pixel resolution for samples up to 100 mm in diameter and 1 kg weight.
  • MicroXCT-400 – a large enclosure system ideal for in-situ studies. Resolution is identical to the MicroXCT-200, but sample size can be up to 200 mm in diameter and 15 kg weight.

For further zooming in to nano scale imaging, the Xradia UltraXRM-L200 is the only commercially available X-ray CT microscope. Using zone plate and capillary based X-ray optics the UltraXRM-L200 has a resolution of down to 50 nm and depth of focus up to 65 microns providing additional high resolution volumetric details to complete imaging models.

In addition to our multi-lengthscale lab source based solutions, Xradia offers imaging systems for synchrotron sources. The UltraXRM-S200 is a full volume imaging system with resolution down to 30 nm. The UltraSPX-S series brings established X-ray analytical techniques, such as X-ray fluorescence, spectroscopy, and diffraction down to the nanometer scale. This scanning X-ray microscope produces high-resolution maps with elemental, chemical, or crystallographic phase information.

In addition to our X-ray microscopes, we develop and sell a line of advanced optical components for X-ray imaging including zone plates, high-efficiency reflective condensers and phase rings.

Xradia's products provide full volume imaging and elemental mapping solutions with synchrotron and lab sources for applications in life science research and development, materials science development and failure analysis, rock physics modeling for oil and gas drilling feasibility analysis, and semiconductor package development and failure analysis.